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Á¦¸ñ [Àü±âÀüÀÚºÐ¾ß TCº° ÁÖ¿äȸÀÇ À̽´ °øÀ¯] ¹ÝµµÃ¼±â¼úºÐ¾ß
ÀÛ¼ºÀÚ Àå¸íÁø µî·ÏÀÏ 2018.11.15 Á¶È¸ 700

IEC/TC 47/SC 47E, SC 47F ȸÀÇ 0606 ÃâÀå¿ä¾à

1. ȸ ÀÇ ¸í: IEC/TC 47/SC 47E, SC 47F ȸÀÇ

2. ȸÀDZⰣ: 2018. 06. 07. - 06. 08.

3. ȸÀÇÀå¼Ò: ¹Ì±¹ È£³î·ê·ç

4. Âü ¼® ÀÚ: Á¼ºÈÆ ±³¼ö(Çѱ¹°úÇбâ¼ú´ëÇб³)

5. Âü¼®ÀÚ°Ý: IEC/TC 47/SC 47F/WG 1 ÄÁºñ³Ê

 

6. »ê¾÷°è ÀüÆij»¿ë ¿ä¾à

¨ç ³íÀÇ »ç¾ÈÀÇ °æÁ¦Àû±â¼úÀû Á߿伺

 SC 47F MEMS ºÐ¾ßÀÇ È°¼ºÈ­¸¦ À§ÇÏ¿© °¢ Working group º°·Î RoadmapÀ» ¸¸µé¾î 10¿ù

ºÎ»ê General Meeting¿¡¼­ ¹ßÇ¥Çϱâ·Î ÇÔ.

¡ª ¼¾¼­ ºÎºÐÀÇ Ç¥ÁصéÀÌ ÃÖ±Ù µé¾î Áõ°¡ÇÔ¿¡ µû¶ó¼­ ¿þ¾î·¯ºí, ÀΰøÁö´É µî°ú Á¢¸ñÇÑ ½Å

½ÃÀå¿¡ ´ëÇÑ ¸íÈ®ÇÑ ¸ñÇ¥¼³Á¤°ú ÇÔ²² MEMS ºÐ¾ßÀÇ È¸»ç ¹× »ê¾÷¿¡¼­ ÇÊ¿äÇÑ Ç¥ÁØÀ»

°³¹ßÇϱâ·Î ÇÔ. µû¶ó¼­ MEMS ½Å·Ú¼º °ü·Ã Ç¥ÁØ¿¡ ÁýÁßÇÏ¿© Ç¥ÁØÀ» °³¹ßÇÒ ÇÊ¿ä°¡ ÀÖÀ½.

¡ª ¿©·¯ °³ÀÇ ¼¾¼­¸¦ À¶º¹ÇÕÇÑ º¹ÇÕ ¼¾¼­ ±â¼úÀÌ ÇÊ¿äÇÔ¿¡ µû¶ó ÀÌ·¯ÇÑ º¹ÇÕ¼¾¼­ÀÇ °³¹ß ¹×

¼º´É ¹× ½Å·Ú¼ºÀ» ÃøÁ¤ÇÒ ¼ö Àִ ǥÁØÈ­°¡ ÇÊ¿äÇÑ »óȲÀÓ.

¡ª À¯·´ ¹× ¹Ì±¹ÀÇ MEMS »ê¾÷°è °¡·É, MEMS industry group µî°ú Çù·ÂÇÒ ¹æ¾ÈÀ» ¸ð»öÇÔ.

¨è À§¿øȸ ÀïÁ¡ »çÇ×

 IEC 62047-35: Standard test procedure for the anti-failure robustness of flexible or foldable

electro-mechanical devices against bending deformation ¹®°ÇÀº ¼öÁ¤ÇÏ¿© CD¸¦ ´Ù½Ã

Á¦ÃâÇϱâ·Î ÇÏ¿´À½.

¡ª ÇâÈÄ º» ȸÀÇÀÇ ¸íĪÀ» º¯°æÇÏ¿© Busan General Meeting¿¡¼­ È®Á¤Çϱâ·Î ÇÔ. 

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